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CVD ALD Atomic Layer Deposition System for Powder Coating Plating
The Thermal Atomic Layer Deposition System is a high-precision single-wafer deposition system. It is specifically engineered for scientific research and small-scale industrial experimentation. Fully CE compliant, it is a critical tool in micro-electronics, nano-materials, optical films, and solar battery development.
Advanced Software Control: Features an integrated system for technological formulation, precise parameter settings, popedom management, interlocking alarms, and real-time state supervisory control.
| Wafer Dimension | 8 inch and below |
| Wafer temperature | RT-400ºC, Precision ±0.1ºC |
| Number of precursor | Three precursor lines (Optional more) |
| Temp. of precursor lines | RT-200ºC, Precision ±0.1ºC |
| Temp. of source bottles | RT-200ºC, Precision ±0.1ºC |
| Background vacuum | <5*10⁻³ Torr |
| Gas carrier system | N2 or Ar |
| Growing mode | Consecutive or interval deposition |
| Controlling system | PLC + Touch screen / Display |
| Deposition Heterogeneity | <±1% |
| Dimensions | 600mm x 600mm x 1100mm |
